1. 2. 3. material content data sheet sales product name tle8203e issued 4. september 2015 ma# ma001387212 package pg-dso-36-50 weight* 609.88 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 8.642 1.42 1.42 14171 14171 leadframe inorganic material phosphorus 7723-14-0 0.057 0.01 93 non noble metal zinc 7440-66-6 0.227 0.04 373 non noble metal iron 7439-89-6 4.546 0.75 7453 non noble metal copper 7440-50-8 184.568 30.26 31.06 302629 310548 wire noble metal gold 7440-57-5 2.936 0.48 0.48 4814 4814 encapsulation organic material carbon black 1333-86-4 0.801 0.13 1313 plastics epoxy resin - 36.825 6.04 60381 inorganic material silicondioxide 60676-86-0 362.648 59.45 65.62 594621 656315 leadfinish non noble metal tin 7440-31-5 5.508 0.90 0.90 9032 9032 plating noble metal silver 7440-22-4 0.791 0.13 0.13 1297 1297 glue plastics epoxy resin - 0.583 0.10 956 noble metal silver 7440-22-4 1.748 0.29 0.39 2867 3823 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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